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Memory Module Specification

TECHNOLOGY

Document No. 4805507-001.A00

03/04/10

KHX2000C9AD3T1FK3/6GX

6GB (2GB 256M x 64-Bit x 3 pcs.) DDR3-2000MHz

CL9 240-Pin DIMM Kit w/ Fan

Page 1

DESCRIPTION:

Kingston's KHX2000C9AD3T1FK3/6GX is a kit of three 256M x 64-bit 2GB (2048MB) DDR3-2000MHz CL9 SDRAM

(Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each

module kit supports Intel

XMP (Extreme Memory Profiles). Total kit capacity is 6GB. Each module kit has been tested

to run at DDR3-2000MHz at a low latency timing of 9-11-9 at 1.65V. The SPDs are programmed to JEDEC standard

latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.

The JEDEC standard electrical and mechanical specifications are as follows:

This special kit part number includes Kingston's HyperX high-performance cooling fan assembly (KHX-FAN).

FEATURES:

JEDEC standard 1.5V ± 0.075V Power Supply

VDDQ = 1.5V ± 0.075V

667MHz fCK for 1333Mb/sec/pin

8 independent internal bank

Programmable CAS Latency: 5,6,7,8,9,10

Posted CAS

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

8-bit pre-fetch

Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4

which does not allow seamless read or write [either on the fly using A12 or MRS]

Bi-directional Differential Data Strobe

Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

On Die Termination using ODT pin

Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C

Asynchronous Reset

PCB : Height 2.401” (61.00mm) w/ heatsink, double sided component

PERFORMANCE:

CL(IDD) 9 cycles

Row Cycle Time (tRCmin) 49.5ns (min.)

Refresh to Active/Refresh Command Time (tRFCmin) 110ns

Row Active Time (tRASmin) 36ns (min.)

Power 1.800 W (operating per module)

UL Rating 94 V - 0

Operating Temperature 0

C to 85

Storage Temperature -55

C to +100

Keyed

1 2 3 4 5 6 7

Sommario

Pagina 1 - Memory Module Specification

Memory Module SpecificationTECHNOLOGYDocument No. 4805507-001.A0003/04/10KHX2000C9AD3T1FK3/6GX6GB (2GB 256M x 64-Bit x 3 pcs.) DDR3-2000MHzCL9 240-Pin

Pagina 2 - MODULE DIMENSIONS:

KingstonDocument No. 4805507-001.A00 Page 2MODULE DIMENSIONS:61mm2.401w/ heatsink assemblyUnits: millimeters30.0018.8015.8011.008.000.00133.350.0054.

Pagina 3 - HyperX Cooling Fan Assembly

KingstonDocument No. 4805507-001.A00 Page 3KHX-FANHyperX Cooling Fan AssemblyDESCRIPTION:This document describes Kingston's HyperX memory module

Pagina 4 - Part Number: KHX-FAN

KingstonDocument No. 4805507-001.A00 Page 4Part Number: KHX-FANTECHNO L O GYASSEMBLY:

Pagina 5 - (Unit: Inches)

KingstonDocument No. 4805507-001.A00 Page 5DIMENSIONS:(Unit: Inches)

Pagina 6 - INSTALLATION:

KingstonDocument No. 4805507-001.A00 Page 6INSTALLATION:

Pagina 7 - INSTALLATION (cont.):

KingstonDocument No. 4805507-001.A00 Page 7INSTALLATION (cont.):

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