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KHX24C11T1K2/8X

8GB (4GB 512M x 64-Bit x 2 pcs.)

DDR3-2400 CL11 240-Pin DIMM Kit

DESCRIPTION

Kingston's KHX24C11T1K2/8X is a kit of two 512M x 64-bit

(4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM), 2Rx8

memory modules, based on sixteen 256M x 8-bit FBGA

components per module. Each module kit supports Intel

XMP

(Extreme Memory Profiles). Total kit capacity is 8GB. Each

module kit has been tested to run at DDR3-2400 at a low

latency timing of 11-13-13 at 1.65V. The SPDs are pro-

grammed to JEDEC standard latency DDR3-1333 timing of

9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers.

The JEDEC standard electrical and mechanical specifications

are as follows:

Document No. 4806400-001.A00 04/05/12 Page 1

SPECIFICATIONS

CL(IDD) 9 cycles

Row Cycle Time (tRCmin) 49.5ns (min.)

Refresh to Active/Refresh 160ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin) 36ns (min.)

Maximum Operating Power 2.400 W* (per module)

UL Rating 94 V - 0

Operating Temperature 0

C to 85

Storage Temperature -55

C to +100

*Power will vary depending on the SDRAM used.

FEATURES

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE

< 95°C

• Asynchronous Reset

• PCB : Height 2.401” (61.00mm) w/ heatsink, double sided

component

Memory Module Speciﬁ cations

Continued >>

XMP TIMING PARAMETERS

• JEDEC: DDR3-1333 CL9-9-9 @1.5V

• XMP Profile #1: D3-2400 CL11-13-13 @1.65V

• XMP Profile #2: D3-2133 CL11-12-11 @1.60V

Keyed

1 2

Sommario

Pagina 1 - Memory Module Speciﬁ cations

KHX24C11T1K2/8X8GB (4GB 512M x 64-Bit x 2 pcs.)DDR3-2400 CL11 240-Pin DIMM KitDESCRIPTIONKingston's KHX24C11T1K2/8X is a kit of two 512M x 64-bit

Pagina 2 - MODULE WITH HEAT SPREADER

MODULE DIMENSIONSDocument No. 4806400-001.A00 Page 2MODULE WITH HEAT SPREADERcontinued HyperXAll Kingston products are tested to meet our publish

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