Kingston Technology KHX3200K2/2G Scheda Tecnica

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Memory Module Specification
Document No. 4803853-001.B00
01/28/04
KHX3200K2/2G
2GB (1GB 128M x 64-Bit x 2 pcs.)
PC3200 CL2.5 184-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX3200K2/2G is a kit of two 128M x 64-bit 1GB (1024MB) DDR400 CL2.5 SDRAM
(Synchronous DRAM) memory modules. Total kit capacity is 2GB (2048MB). The components on
each module include sixteen 64M x 8-bit (16M x 8-bit x 4 Bank / 200MHz, 5ns) DDR400 SDRAM
in TSOP packages. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical
and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2.5, 3 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2.5-3-3-7-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (34.75mm), double sided component
PERFORMANCE:
Clock Cycle Time (tCK) 5ns (min.) / 10ns (max.)
Row Cycle Time (tRC) 55ns (min.)
Refresh Row Cycle Time (tRFC) 70ns (min.)
Row Active Time (tRAS) 40ns (min.) / 70,000ns (max.)
Power (IDD0) 5.408 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0
o
C to 70
o
C
Storage Temperature -55
o
C to +150
o
C
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Sommario

Pagina 1 - Memory Module Specification

Memory Module SpecificationDocument No. 4803853-001.B0001/28/04KHX3200K2/2G2GB (1GB 128M x 64-Bit x 2 pcs.)PC3200 CL2.5 184-Pin DIMM KitKEYEDPage 1DES

Pagina 2 - MODULE DIMENSIONS:

Kingston TechnologyDocument No. 4803853-001.B00 Page 2MODULE DIMENSIONS:0.0500.0078 ±0.006(0.20 ±0.15)(1.270)0.100(2.50 )0.250(6.350)0.157(4.00)0.071(

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